Metalization
Metalization can also be used in applications when diamond is a new addition to an existing process. Coating the diamond with metal can permit low temperature bonding of diamond in the semiconductor, optoelectronic and tool-making industries.
Diamond metalization schemes usually involve three different metals. The first, closest to the diamond, is a carbide-former such as titanium, tungsten or chromium. These metals make a chemical bond with the diamond to insure adhesion of the metalization. A diffusion-barrier is then applied, typically palladium or platinum. Finally the layer required for the process is added. Gold or silver are usually used to prepare the diamond for brazing, eutectic bonding or other attachment techniques.
Our standard metalization scheme is:
- Titanium - 1,000A
- Platinum - 1,000A
- Gold - 10,000A