Laser Sawing and Scribing
Applied Diamond's laser has been successfully sawing diamond for many years. Use our laser capability in conjunction with our other processes to produce finished parts from your CVD diamond raw material. You'll find our engineers knowledgeable regarding what is possible and how we can work together most efficiently and economically. We work hard to keep our services quick and inexpensive, too.
Historically, a Q-switched Nd:YAG laser has been used for sawing diamond, whether single crystal or CVD. The beam delivery optics and the part being cut are moved relative to one another in order to cut parts of specific geometry.
The resolution of the moving stages, specifications of the delivery optics, and performance of the laser determine the amount of material removed, quality of the cut and minimum tolerances that can be held.
At Applied Diamond, we can cut samples over 1 mm thick and hold dimensional tolerances to +/- 10 microns (.0005 in.) The computer-controlled stages allow a wide variety of shapes to be cut; we've even done crescents and stars. Small and large jobs can be accomplished quickly and economically with this system. Laser cutting also works well for scribing and cleaving thin diamond layers on silicon wafers.